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Background
Integrated Complex Equipment
Background Equipment

Characteristics

  • Precise pressure control: Tight delivery pressure control (±50 mbar) for stable liquid flow and vaporization
  • Reliability features: Patented back-up mode, smart empty control for 100% chemical usage, and validated chemical purge sequences
  • Control system: PLC-based technology with a 10" color touch screen for operation
  • Compatibility: Accepts any SEMI-compliant canister, with customized signal interfaces for OEM tools
  • Utilities requirements: Supports UHP He/N₂ (7barg, 10m³/hr), pneumatic air, exhaust (300m³/hr), vacuum (<1Torr), and UPS power (110/240VAC, 1kVA)

Main Features

Feature 1

Designed for contamination-free, reliable, and cost-saving delivery of advanced precursors

Feature 1

Supports on-board bubbler refill and canister change-out sequences

Feature 1

Back-up distribution mode ensures continuous operation

Feature 1

mart empty control maximizes chemical utilization

Feature 1

Optional upgrades: vacuum pump, degassing unit, 2-outlet manifold, remote monitoring (Profibus/Ethernet), and operator training

Applications

Application Background
Semiconductor manufacturing processes
Chemical Vapor Deposition (CVD)
Atomic Layer Deposition (ALD)
Processes involving advanced liquid precursors (e.g., TEOS, TEPO, TEB, 4MS, TMA, HCDS)

Suitable Occasions

Nitrogen

High-precision vaporization applications requiring stable pressure control

Nitrogen

Continuous manufacturing processes needing contamination-free precursor delivery

Nitrogen

Facilities with advanced semiconductor deposition tools

Suitable for Fluids

Application Background
BPSG processes: TEOS, TEPO, TEB
Low-k dielectrics: 4MS, DMDMOS, TMCTS, OMTCS, DMPS
High-k dielectrics: TMA, TDMAS
Low-T SiN: HCDS, BTBAS
Other SEMI-compliant liquid chemicals for CVD/ALD processes

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